Intel asserts that for next-generation chips, its 3D stacked CMOS transistors offer superior performance and scaling

    According to Intel, a better way to glue things together is with its 3D stacked CMOS transistors, which combine direct backside contact and backside power to provide increased performance and scaling for next-generation chips.

    To go beyond Moore’s Law in semiconductors, constant innovation is essential. The tech community has noticed several of these innovations, including Intel’s 3D stacked complementary metal-oxide-semiconductor (CMOS) transistors.

    In semiconductors, pushing the limits of Moore’s Law requires constant gluing things together *coughs* (innovation). The tech community has taken notice of a few of these innovations, including Intel’s 3D stacked complementary metal-oxide-semiconductor (CMOS) transistors.

    At the 2023 IEEE International Electron Devices Meeting (IEDM), Intel researchers showcased their advancements in 3D stacked complementary metal oxide semiconductor (CMOS) transistors featuring direct backside contacts and backside power. Instead of on the package, the company was the first to successfully demonstrate large-scale 3D monolithic integration of silicon and gallium nitride (GaN) transistors on the same 300-millimeter (mm) wafer. Additionally, it discussed the scalability of recent R&D achievements in backside power delivery, including backside contacts.

    Why This Is Important: Well, to start, it’s Intel, so it won’t glue things together, like literally, AMD does that, Intel is way superior, they won’t dip to that level, or would they? who knows. Secondly, transistor scaling and backside power are crucial to helping meet the rapidly increasing demand for more powerful computing. Intel demonstrates that its innovations will continue to propel the semiconductor industry and provide the basis for Moore’s Law by meeting this demand for computing power year after year.

    Intel’s Components Research group consistently pushes the boundaries of engineering by stacking transistors, increasing backside power to enable more transistor scaling and better performance, and demonstrating that transistors made of different materials can be integrated on the same wafer.

    intel 3d stacked cmos
    The design on top of the wafer is depicted in the image on the left, where power and signal wires are mixed together. The image on the right displays Intel’s innovative industry-first backside power delivery network, called PowerVia. On July 26, 2021, PowerVia was unveiled at the “Intel Accelerated” event. Intel gave presentations about the company’s packaging technology and future process roadmaps at the event. Intel Corporation is credited.

    For the first time in the industry, Intel offers 3D stacked CMOS transistors with backside power and backside contact:

    Intel’s latest transistor research, which was showcased at IEDM 2023, demonstrated an industry-first: ability to stack complementary field effect transistors (CFETs) vertically at a scaled gate pitch as small as 60 nanometers (nm). This enables transistor stacking, which raises area efficiency and performance. It is also combined with backside power and direct backside contacts. It emphasizes how much better Intel is than competitors in the area of gate-all-around technology and demonstrates the company’s capacity for innovation beyond RibbonFET.

    intel 3d stacked cmos

    After four years, Intel has identified the key R&D domains needed to maintain transistor scaling with backside power delivery and surpass five nodes:

    The first backside power delivery system from Intel, called PowerVia, will go on sale in 2024. At IEDM 2023, Components Research presented crucial process innovations that are required to enable backside power delivery pathways that surpass PowerVia. Additionally, this work showed how to use other state-of-the-art vertical interconnects and backside contacts to enable area-efficient device stacking.

    We appreciate your reading of this article. Feel free to check out our other articles here if you liked them and would like to read more tech-related stuff. Keep checking back for additional information and perspectives on the tech industry. Enjoy your reading!

    Latest articles


    Related articles

    Leave a reply

    Please enter your comment!
    Please enter your name here